Kuala lumpur: The government is targeting the advanced packaging technology developed through research and development (RandD) projects under the Malaysia Science Endowment (MSE) to be fully commercialised after a two-year capacity-building period, the Dewan Rakyat was told today.
According to BERNAMA News Agency, Science, Technology and Innovation Minister Datuk Chang Lih Kang stated that the RM185 million pilot project involved a consortium comprising five local companies and government institutions, aimed at strengthening the country's semiconductor supply chain. The allocation was provided in the form of grants to raise the project's Technology Readiness Level (TRL) from TRL 5 to TRL 9, enabling the technology to be ready for market entry.
Chang explained that the two-year capacity-building period is designed to train local companies in advanced packaging activities. Upon reaching TRL 9, the technology will be ready for market entry. Following this period, the industry will assume full responsibility, including securing its own customers and financing, to avoid over-reliance on government funding.
The consortium approach facilitates local companies in developing advanced packaging technology competitively while enhancing long-term industry capacity. MSE's current role is to expedite the transition of technology from the RandD stage to the commercialisation phase, enabling the industry to seek financing from other sources.
The implementation of the advanced packaging programme under MSE is seen as a strategic government investment to develop local technological capabilities in the next-generation semiconductor industry. This industry supports applications in artificial intelligence (AI), data centres, high-performance computing, smart automotive, 5G, and quantum technology.
Chang emphasized that the initiative aims not only to produce Malaysia's first advanced packaging technology but also to catalyse the transformation of the country's semiconductor industry towards high-value-added activities through the development of local technology, innovation, and intellectual property.