Leoben-Hinterberg: Today, the International Finance Corporation (IFC), a member of the World Bank Group, and ATandS have signed a sustainability-linked loan agreement worth 250 million US dollars at the ATandS headquarters in Leoben-Hinterberg. This agreement aims to finance a state-of-the-art integrated circuit (IC) substrate plant in Kulim, Malaysia. The loan, which comes directly from IFC, may be supplemented by an additional 150 million US dollars from local banks under the same agreement.

According to BERNAMA News Agency, the sustainability-linked loan includes financial incentives for ATandS to reduce its annual greenhouse-gas emissions by 31 percent by March 31, 2028, using the fiscal year 2022 as the baseline. This initiative underscores the commitment of both IFC and ATandS to promote sustainable practices in the technology sector while contributing to Malaysia’s economic development.