Tokyo: Toshiba Electronic Devices and Storage Corporation (Toshiba) has launched four new voltage-driven photorelays, namely 'TLP3407SRB', 'TLP3412SRB', 'TLP3412SRHB', and 'TLP3412SRLB', which are housed in the compact S-VSON4T package.

According to BERNAMA News Agency, volume shipments of these photorelays commence today. The newly introduced photorelays are designed to withstand a maximum operating temperature of 135 degrees Celsius, an improvement from the previous models' 125°C. These are targeted towards automotive semiconductor testers, probe cards, and burn-in equipment that function in high-temperature environments.

Advances in electrification and autonomous driving technologies have led to an increased need for compact electronic component packaging in automotive applications, necessitating semiconductors and supporting devices to perform reliably at elevated temperatures.

Toshiba explained that the temperature enhancement was achieved by optimizing the design of the built-in elements. The photorelays feature a voltage-driven mechanism with integrated resistors on the input side, which eliminates the need for external resistors and helps reduce board space requirements.

The S-VSON4T package dimensions are 1.45 ‚¬Å¡¬€¦¡¬€š¬¦¡¬€š¬…¡¬¦¡¬€š¬…¡¬‚¬¦¡¬¦¡¬€š¬…¡¬‚¬¦¡¬‚¬Å¡¬¦¡¬‚¬Å¡¬€¦¡¬¦¡¬ 2.0 millimetres, allowing for the mounting of multiple photorelays in a constrained board area while ensuring reliable operation under high-temperature conditions.

Toshiba emphasized that the combination of compact size, high-temperature resistance, and integrated resistor design makes these photorelays particularly suitable for automotive semiconductor testing and burn-in applications. The company also mentioned its plans to continue expanding its range of products that support high-temperature operations in both automotive and industrial equipment sectors.