Kuala Lumpur: Silicon Connect Sdn Bhd and UK-based Semiwise Ltd have signed a memorandum of understanding (MoU) aimed at sharing expertise in electronics, semiconductors, and related technologies. Silicon Connect’s CEO, Chin Yoong Tatt, highlighted that the collaboration will focus on developing scalable pathways for power electronics modules, offering comprehensive solutions that cover design modeling, rapid prototyping, process optimization, and advanced panel-level packaging.

According to BERNAMA News Agency, the MoU was witnessed by Deputy Minister of Investment Trade and Industry, Liew Chin Tong, and UK Minister for Indo-Pacific, Catherine West. The partnership underscores the complementarity between the UK’s strengths in research, development, innovation, and intellectual property, alongside Malaysia’s manufacturing and precision engineering expertise.

Chin stated that the agreement includes semiconductor training programs and aims to foster a collaborative environment for product development and joint business opportunities. Plans are also in place for Silicon Connect to establish an office in the UK, dependent on future opportunities.

The collaboration seeks to advance 3D interconnect technology, which is crucial for integrating multi-chip heterogeneous systems, especially for high-performance computing and artificial intelligence hardware. This involves developing processes such as Through-Silicon Vias, hybrid copper bonding, micro-bumping, and wafer-to-wafer bonding.

Chin further emphasized that the partnership represents a new model of collaboration, allowing both countries to act as peers and complement each other’s strengths. The UK’s expertise in intellectual property, innovation, and technology will be complemented by Malaysia’s capabilities in manufacturing and equipment, facilitating the scaling and commercialization of innovations.

This synergy is expected to enhance the global appeal of Malaysia and the UK within the competitive semiconductor supply chain.