Leuven: Nearfield Instruments, the leader in 3D, non-destructive, in-line process control solutions, has announced a strategic collaboration with Imec to accelerate innovation in semiconductor metrology. Nearfield Instruments Chief Executive Officer (CEO), Dr. Hamed Sadeghian, stated that partnering with Imec allows the company to push the boundaries of what is possible in semiconductor manufacturing process control. The collaboration aims to address metrology challenges, including 3D profiling of CFETs and hybrid bonding characterization, to enable advancements in High-NA EUV lithography through full 3D resist imaging.

According to BERNAMA News Agency, this collaboration marks a significant step forward in bridging cutting-edge metrology innovation with advanced semiconductor process development. By combining Nearfield Instruments’ proven technology with Imec’s visionary research programs, the partnership aims to deliver impactful solutions that will shape the future of chip manufacturing.

The partnership will deploy Nearfield’s QUADRA system at Imec’s advanced research and development (R and D) facility in Leuven to develop next-generation metrology solutions for High-NA EUV lithography, 3D logic device profiling, and heterogeneous integration. This initiative addresses critical challenges in precision, speed, and scalability for artificial intelligence (AI)-chip manufacturing.

Based in Rotterdam, Netherlands, Nearfield Instruments specializes in advanced metrology and inspection solutions for the semiconductor industry. The company focuses on developing and commercializing next-generation scanning probe microscopy systems that deliver true 3D nanometre-scale metrology.