Tokyo: Kioxia Corporation, a leader in memory solutions, has announced the sampling of its new Universal Flash Storage (UFS) Ver. 4.1 embedded memory devices. This initiative underscores the company’s position in high-performance storage. Designed for next-generation mobile applications, including advanced smartphones with on-device AI, these devices offer enhanced performance and improved power efficiency in a compact BGA package.

According to BERNAMA News Agency, the UFS Ver. 4.1 devices from Kioxia incorporate the company’s BiCS FLASHS 3D flash memory and a controller within a JEDEC-standard package. The devices feature Kioxia’s 8th generation BiCS FLASHS 3D flash memory, which introduces CMOS directly Bonded to Array (CBA) technology. This architectural innovation represents a significant development in flash memory design, allowing for substantial improvements in power efficiency, performance, and density by directly bonding the CMOS circuitry to the memory array.